Amazon
Cloud Hardware Development, Packaging, Network Product Development - Optics
$183K–$248K
Virtual Location - Arizona, AZ +1 · Remote · Full-time · Posted Aug 12, 2026
- Location
- Virtual Location - Arizona, AZ
Cupertino, CA - Experience
- 8+ years in IC/SOC packaging design, development, or validation; 8+ years in signal integrity, transmission line theory, and package electrical modeling; 2+ years working with packaging suppliers and qualification processes; 1+ years of automation scripting.
- Education
- Bachelor's degree or above in mechanical engineering, electrical engineering, materials science, or physics.
About the job
Designs, validates, and sustains IC and SoC packages for high-speed AWS network interconnect hardware, partnering with suppliers and internal teams to deliver scalable, reliable components.
What you'll do
- Evaluate packaging technologies, materials, and assembly processes with manufacturers and plan their adoption in product roadmaps.
- Develop and automate package characterization and qualification tests, including signal integrity, power integrity, thermal performance, and mechanical reliability.
- Partner with operations and suppliers to resolve quality issues, improve manufacturing yields, and optimize RMA processes.
What they ask for
- Bachelor's degree or above in mechanical engineering, electrical engineering, materials science, or physics.
- 8+ years of work experience on IC/SOC packaging design, development, or validation.
- 8+ years of experience with high-speed signal integrity principles, transmission line theory, and package electrical modeling.
- 2+ years working with IC/SOC packaging suppliers, substrate manufacturers, assembly houses, and qualification processes; 1+ years of automation scripting using Python, Bash, Shell and/or Matlab.
Nice to have
- Ph.D. in mechanical engineering, electrical engineering, material science, physics or equivalent.
- Expertise in package design, mechanical stress analysis, thermal management, reliability engineering, or troubleshooting package-level failures and signal integrity issues.
Pay
USD 183,000.00 - 247,600.00 annually (base salary)
Tools
IC, SOC, Python, Bash, Shell, Matlab, OSAT
Model-written summary · the original posting is authoritative