Amazon
Fabrication Support Engineer, AWS CQC - Fabrication
$75K–$131K
Pasadena, CA · Full-time · Posted Sep 24, 2026
- Experience
- 2+ years of technical support experience; 2 years of direct microfabrication experience; 2 years of hands-on wafer- and die-level handling experience. Preferred experience includes 2 years in one or more listed processes.
- Visa sponsorship
- Candidates must be a U.S. citizen or national, U.S. permanent resident, lawfully admitted into the U.S. as a refugee or granted asylum, or able to obtain a U.S. export license.
About the job
Supports fabrication and characterization of quantum processor chips by operating and improving cleanroom packaging processes and equipment.
What you'll do
- Lead development and sustainment of die singulation, die preparation, and device probing; provide support for wirebonding and flip chip bonding.
- Operate, maintain, and troubleshoot process equipment, and build backend infrastructure and standardized workflows.
- Analyze process data to improve stability and yield.
What they ask for
- 2+ years of technical support experience.
- 2 years of direct microfabrication experience.
- 2 years of hands-on wafer- and die-level handling, die cleaning, and optical inspection equipment experience.
- Excellent communication and writing skills.
Nice to have
- 2 years of experience with one or more of: Saw Dicing, Electrical test (Probing), Wirebonding, Flip Chip Bonding.
- Experience in microfabrication R&D, process development or failure analysis, data analysis and visualization, or inventory management and MES.
Pay
USD 74,700.00 - 130,700.00 annually (base salary)
Tools
Saw Dicing, Electrical test (Probing), Wirebonding, Flip Chip Bonding, MES system
Model-written summary · the original posting is authoritative