Amazon
Memory Subsystem Engineer, MLA Technology
$159K–$215K
Austin, TX · Full-time · Posted Sep 17, 2026
- Experience
- 5+ years of practical semiconductor design work; preferred: 3+ years in SOC/IO/Subsystems Experience.
- Education
- Bachelor's degree in Electrical Engineering, Computer Engineering, Systems Engineering, or related fields.
About the job
Designs, integrates, validates, and supports memory subsystems for AWS machine-learning chips and servers, improving their performance and reliability in manufacturing and data centers.
What you'll do
- Collaborate with architecture, design, and software teams on next-generation ML chips; support debug and operations of existing chips.
- Handle memory subsystem IP integration, packaging, silicon bring-up, characterization, and validation.
- Develop scripts and collect and analyze data at scale to debug fleet-wide issues and improve product reliability.
What they ask for
- Bachelor's degree in Electrical Engineering, Computer Engineering, Systems Engineering, or a related field.
- 5+ years of practical semiconductor design work, including full-chip and subsystem integration.
- Knowledge of memory training, timing parameters and/or controller features.
- Ability to create scripts (lua, bash, python, etc.) and knowledge of DDR/HBM/UCIe phy and controller-related protocols.
Nice to have
- 3+ years in SOC/IO/Subsystems Experience working with physical design teams on optimized ASICs.
- Experience with IP integration, 2.5D packaging, clocking and timing constraints, and system-level debug through production.
Pay
159,200.00 - 215,300.00 USD annually (base salary)
Tools
HBM, SRAM, UCIe, DDR, lua, bash, python, SERDES
AI focus
Supports the design, integration, validation, and data-center operation of next-generation machine-learning chips and servers.
Model-written summary · the original posting is authoritative