Drimva

Amazon

Package Engineer, Annapurna Labs - AI Silicon Packaging

$154K–$215K

Tempe, AZ +1 · Full-time · Posted Oct 22, 2026

Location
Tempe, AZ
Austin, TX
Experience
6+ years of industry experience in a related field as an alternative to a bachelor’s degree; preferred alternatives include 8+ years with a master’s or 6+ years with a PhD.
Education
Bachelor’s in Materials Science, Mechanical Engineering, Electrical Engineering, or Chemical Engineering, or 6+ years of industry experience in a related field.

About the job

Develops package technologies for next-generation Trainium AI accelerators, guiding designs and processes from concept through qualification and volume production.

What you'll do

  • Drive package technology development across architecture, design, materials, processes, yield, reliability, and system integration.
  • Coordinate with suppliers and manufacturing partners on validation, qualification, risk reduction, and root-cause analysis.
  • Evaluate technology tradeoffs and represent the team in cross-functional design reviews and program checkpoints.

What they ask for

  • Experience coordinating technical teams, peers, and business stakeholders.
  • Bachelor’s degree in a listed engineering or materials science field, or 6+ years of related industry experience.
  • Expertise in at least one of substrate/PCB technology, interposer technology, or package and board assembly technology.
  • Track record of driving technology development from concept through qualification.

Nice to have

  • Master’s degree in a listed field or 8+ years of related experience; or PhD in a listed field or 6+ years of related experience.
  • Familiarity with package-level SI/PI, advanced substrate/interposer processes, or package and board assembly processes; CPO experience is a plus.

Pay

USD 153,600.00 - 215,000.00 annually base salary (USA, AZ, Tempe); USD 153,600.00 - 215,000.00 annually base salary (USA, TX, Austin)

Tools

Trainium, HDI, CoWoS-R/L, RDL, TSV, SI/PI, CPO, TIM

AI focus

Develops packaging technologies for next-generation Trainium AI accelerators.

Model-written summary · the original posting is authoritative

First seen Oct 23, 2026 · Last verified Nov 5, 2026 (UTC)