Amazon
Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging
$154K–$247K
Austin, TX +2 · Full-time · Posted Sep 8, 2026
- Location
- Austin, TX
San Diego, CA
Cupertino, CA - Experience
- 5+ years of experience in signal integrity, power integrity, or package design; preferred qualifications also list 3+ years in these areas.
- Education
- Bachelor's degree in Electrical Engineering or a related field.
About the job
Performs package-level signal or power integrity analysis and optimization for advanced packaging used in next-generation machine-learning and data-center ASICs.
What you'll do
- Run package SI/PI and high-speed channel simulations, build and validate models, and support package stack-up design.
- Coordinate package co-optimization with silicon and board teams and identify manufacturing risks with mitigation approaches.
- Analyze advanced interconnects, package PDN performance, and decoupling technologies.
What they ask for
- Bachelor's degree in Electrical Engineering or a related field.
- Solid understanding of either SI or PI, with working awareness of the other.
- Experience with EM simulation and SI/PI tools such as HFSS, Cadence Sigrity (PowerSI, PowerDC, Clarity), ADS, or equivalent.
- Understanding of advanced packaging technologies and familiarity with stack-up design and impedance control.
Nice to have
- Master's degree in Electrical Engineering or a related field.
- Exposure to high-speed serial protocols, lab measurement correlation, or package co-design methodologies.
Pay
176,600.00 - 247,300.00 USD annually (base salary); 153,600.00 - 215,000.00 USD annually (base salary)
Tools
HFSS, Cadence Sigrity (PowerSI, PowerDC, Clarity), ADS, PCIe, UCIe, TDR, VNA, oscilloscope
AI focus
Supports SI/PI analysis and optimization for advanced packaging solutions for next-generation machine-learning ASICs.
Model-written summary · the original posting is authoritative