Amazon
Sr Manager Package SIPI, Annapurna Labs
$241K–$350K
Austin, TX +2 · Manager · Full-time · Posted Oct 28, 2026
- Location
- Austin, TX
San Diego, CA
Cupertino, CA - Experience
- 12+ years of SI/PI engineering experience; 3+ years of direct people-management experience. Basic qualifications also state 8+ years of practical semiconductor design work as an alternative in a separate degree/design-experience qualification.
- Education
- MS or PhD in Electrical Engineering, with emphasis in electromagnetics, signal integrity, power integrity, or microelectronics; basic qualifications also state a related field.
About the job
Leads a team delivering package-level signal and power integrity solutions for advanced 2.5D/3D chiplet products, from architecture through production.
What you'll do
- Lead and develop SI/PI engineers and set technical priorities and methodology.
- Drive end-to-end SI/PI design, simulation, optimization, and sign-off across package, die, and system interfaces.
- Lead post-silicon validation and model-to-hardware correlation; partner with internal teams and external suppliers.
What they ask for
- MS or PhD in Electrical Engineering (or related field, per basic qualifications).
- 12+ years of progressive SI/PI engineering experience in semiconductor packaging.
- 3+ years of direct people-management experience.
- Hands-on advanced-package SI/PI expertise, including high-speed SerDes, HBM, and PCIe; proficiency with named EDA tools and scripting languages.
Nice to have
- Experience with PCIe Gen7, 200G/400G Ethernet SerDes, or NVLink-class interconnects.
- Experience with UCIe 2.0, HBM4e, NPI, or emerging packaging platforms.
Pay
277,400.00 - 350,000.00 USD annually (base salary); 241,200.00 - 325,600.00 USD annually (base salary)
Tools
CoWoS, EMIB, HBM3/HBM3E/HBM4, PCIe Gen5/Gen6/Gen7, UCIe, Ansys HFSS/SIwave/Q3D, Cadence Sigrity (PowerSI, SystemSI), Python, MATLAB, Tcl
Model-written summary · the original posting is authoritative