Amazon
Sr. Mechanical Engineer, Annapurna Labs, Artificial Intelligence Hardware
$159K–$248K
Austin, TX +2 · Senior · Full-time · Posted Aug 4, 2026
- Location
- Austin, TX
Seattle, WA
Cupertino, CA - Experience
- 7+ years industry experience in Mechanical and Thermal design in electronics packaging; 3+ years of experience in SoC Thermal modelling and IC package transient thermal response.
- Education
- BS degree in mechanical engineering or equivalent.
About the job
Owns thermal and mechanical architecture for ML/AI accelerator platforms, taking systems from concept through production and fleet operations.
What you'll do
- Design and validate thermal, cooling, structural, packaging, and interconnect systems, including air- and liquid-cooled solutions.
- Support production fleets through telemetry monitoring, failure analysis, and mitigation; drive manufacturing readiness and supplier optimization.
- Lead cross-functional design reviews, standardization, and technical direction across engineering and operations teams.
What they ask for
- BS degree in mechanical engineering or equivalent.
- 7+ years industry experience in Mechanical and Thermal design in electronics packaging.
- Experience in thermal and performance measurements and characterization on SoCs, Servers, or related Systems; 3+ years of experience in SoC Thermal modelling and IC package transient thermal response.
- Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems, tolerance analysis, production fleet support, and cross-functional technical project leadership.
Nice to have
- Experience with high-power-density ML/AI accelerator or HPC thermal design and liquid cooling system design.
- Tool familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks.
Pay
183,000.00 - 247,600.00 USD annually (base salary); 159,200.00 - 215,300.00 USD annually (base salary)
Tools
Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, Solidworks, Bash script, Python, Lua
AI focus
Designs and supports thermal and mechanical systems for ML/AI accelerator hardware, including custom Trainium and Inferentia platforms.
Model-written summary · the original posting is authoritative