Amazon
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs
$185K–$250K
Austin, TX · Senior · Full-time · Posted Sep 29, 2026
- Experience
- 5+ years in advanced semiconductor packaging and 10+ years in mechanical design of semiconductor-based systems; both are stated requirements.
- Education
- Master's degree in mechanical engineering or equivalent.
About the job
Designs and optimizes thermal and mechanical packaging for semiconductor-based systems and data-center hardware, from circuit and system design through high-volume manufacturing.
What you'll do
- Design and build thermal and mechanical solutions for hardware deployed in data centers.
- Develop and test packaging architectures and materials, optimizing quality, performance, and cost.
- Work with vendors, ODMs, and internal teams to debug and resolve cross-organizational issues.
What they ask for
- Master's degree in mechanical engineering or equivalent.
- 5+ years industry experience in advanced packaging of semiconductors.
- 10+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design.
- Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software.
Nice to have
- Experience with advanced packaging metrologies and hands-on lab-based thermal and mechanical measurements.
- Experience with thermal-management technologies, including heatsinks, TIMs, and liquid cooling.
Pay
185,200.00 - 250,000.00 USD annually (base salary)
Tools
ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK, TIMs, CFD, DOE
AI focus
Supports hardware for machine-learning acceleration; no AI development work is specified.
Model-written summary · the original posting is authoritative