Amazon
Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging
$154K–$215K
Austin, TX · Full-time · Posted Oct 30, 2026
- Experience
- 5+ years in mechanical design of semiconductor-based systems and 3+ years in advanced semiconductor packaging.
- Education
- Bachelor's degree in mechanical engineering or equivalent.
About the job
Ensures the thermal and mechanical integrity of Annapurna semiconductor packages through simulation, experiments, risk assessment, and cross-functional design collaboration.
What you'll do
- Run finite element simulations and analytical models to assess assembly, test, and reliability risks.
- Design and conduct experiments to validate materials and package or system structures.
- Evaluate future package risks and communicate data-driven recommendations through documentation and design reviews.
What they ask for
- Bachelor's degree in mechanical engineering or equivalent.
- 5+ years industry experience in mechanical design of semiconductor-based systems, including silicon, packaging, and system design.
- 3+ years industry experience in advanced semiconductor packaging; direct experience designing and testing test vehicles and evaluating next-generation materials.
- Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK, or equivalent FEA/CFD software.
Nice to have
- Experience with advanced packaging metrologies and hands-on lab-based thermal and mechanical measurements.
- Experience with product development through high-volume manufacturing, thermal solutions and cooling technologies, CFD and compact RC models, experiments, or thermal/power management.
Pay
153,600.00 - 215,000.00 USD annually (base salary)
Tools
ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK, CFD, DOE, Six Sigma
AI focus
Supports machine-learning and compute workloads by developing robust, next-generation semiconductor packages for Annapurna Labs AI silicon.
Model-written summary · the original posting is authoritative