Drimva

Anduril

Senior Software Engineer (AOSP/Qualcomm SoC Connectivity)

$191K–$253K

Bellevue, Washington, United States · Senior · Full-time · Posted Sep 29, 2026

Experience
8+ years of hands-on AOSP build system and platform customization experience; no separate years stated for other experience.
Visa sponsorship
Must be a U.S. Person due to required access to U.S. export controlled information or facilities.

About the job

Develop and integrate low-level AOSP software for Qualcomm SoCs, focusing on wireless connectivity, coexistence, and platform performance.

What you'll do

  • Customize and optimize Android builds, drivers, HALs, and middleware for wireless connectivity.
  • Develop and debug Wi-Fi and/or Bluetooth software on Qualcomm AOSP SoCs, including connectivity and coexistence.
  • Support hardware-software integration and performance tuning.

What they ask for

  • 8+ years of hands-on experience with the AOSP build system and platform customization.
  • Experience developing and debugging Wi-Fi and/or Bluetooth software on Qualcomm AOSP SoCs.
  • Knowledge of Qualcomm SoC architecture and driver development; proficiency in C/C++ and embedded Linux programming.
  • Familiarity with cross-compilation toolchains and kernel module development; able to travel up to 20%; must be a U.S. Person.

Nice to have

  • Experience with Android connectivity frameworks and HALs, Wi-Fi/Bluetooth coexistence, RF bring-up, and over-the-air debugging.
  • Experience with hardware bring-up and board debugging, power management and thermal control, or security features and trusted execution environments (TEE).

Pay

$191,000 — $253,000 USD (base salary)

Tools

AOSP, Qualcomm SoC, C/C++, embedded Linux, wpa_supplicant, cfg80211/mac80211, Bluetooth stack/BTFM, TEE

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 5, 2026 (UTC)