Drimva

Anduril

Senior Thermal Engineer, Expeditionary AI / HPC Data Centers

$175K–$231K

Mountain View, California, United States +1 · Senior · Full-time · Posted Sep 18, 2026

Location
Mountain View, California, United States
Costa Mesa, California, United States
Experience
5+ years designing thermal management systems for data centers or comparable mission-critical infrastructure.
Education
MS or higher in mechanical engineering, applied physics, or related field focused on heat transfer, fluid dynamics, and HVAC.

About the job

Own the design, modeling, testing, and deployment of cooling systems for modular, transportable AI/HPC data centers operating in austere environments.

What you'll do

  • Design cooling and heat-rejection systems from rack and chip level through the facility, evaluating air, water, and liquid-cooling architectures.
  • Model and validate thermal performance; lead prototype builds, field testing, commissioning, and operational validation.
  • Conduct trade studies and root-cause analysis, develop analysis tools, and present technical status to internal and customer reviews.

What they ask for

  • MS or higher in mechanical engineering, applied physics, or related field focused on heat transfer, fluid dynamics, and HVAC.
  • In-depth understanding of heat transfer and fluid dynamics.
  • 5+ years designing thermal management systems for data centers or comparable mission-critical infrastructure.
  • Full-spectrum data center thermal experience, steady-state and transient thermal system modeling, equipment validation/testing, and CAD experience with Siemens NX or SolidWorks.

Nice to have

  • Python or MATLAB coding; thermal FEA/CFD experience with STAR-CCM+, ANSYS, Icepak or FloEFD.
  • Familiarity with PUE/WUE, high-density AI/HPC compute, or austere modular data centers; ability to obtain and hold a U.S. Secret security clearance.

Pay

$175,000—$231,000 USD base salary

Tools

MATLAB, Python, Siemens NX, SolidWorks, STAR-CCM+, ANSYS, Icepak, FloEFD

AI focus

Thermal management for expeditionary AI/HPC data centers, including cooling high-density compute in austere environments.

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 5, 2026 (UTC)