Drimva

Anduril

Senior Thermal Engineer, Expeditionary AI / HPC Data Centers

$161K–$212K

Costa Mesa, California, United States · Senior · Full-time · Posted Aug 22, 2026

Experience
5+ years designing thermal management systems for data centers or comparable mission-critical infrastructure.
Education
MS or higher in mechanical engineering, applied physics, or a related field focused on heat transfer, fluid dynamics, and HVAC.

About the job

Owns thermal design, analysis, testing, and validation of air- and water-cooled systems for transportable AI/HPC data centers operating in austere environments.

What you'll do

  • Design and analyze cooling architectures from rack and chip level through the facility, including heat rejection and liquid cooling.
  • Model and evaluate system performance, reliability, efficiency, and cost; establish operational limits.
  • Lead prototype builds, field testing, commissioning, failure reviews, and technical presentations.

What they ask for

  • MS or higher in mechanical engineering, applied physics, or a related field focused on heat transfer, fluid dynamics, and HVAC.
  • In-depth understanding of heat transfer and fluid dynamics.
  • Full-spectrum thermal experience for data centers or comparable mission-critical infrastructure, including air- and water-side cooling, chilled water plants, and liquid cooling.
  • Steady-state and transient thermal-system modeling, equipment validation and testing, and CAD experience with Siemens NX or SolidWorks.

Nice to have

  • Python or MATLAB; thermal FEA/CFD tools such as STAR-CCM+, ANSYS, Icepak, or FloEFD.
  • Experience with high-density AI/HPC compute or modular, transportable, ruggedized data centers; ability to obtain and hold a U.S. Secret security clearance.

Pay

$161,000 — $212,000 USD (base salary)

Tools

MATLAB, Python, Siemens NX, SolidWorks, STAR-CCM+, ANSYS, Icepak, FloEFD

AI focus

Thermal management for expeditionary AI/HPC data centers.

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 6, 2026 (UTC)