Drimva

Anduril

Senior Thermal Engineer, Expeditionary AI / HPC Data Centers

$161K–$212K

Seattle, Washington, United States +1 · Senior · Full-time · Posted Sep 18, 2026

Location
Seattle, Washington, United States
Costa Mesa, California, United States
Experience
5+ years designing thermal management systems for data centers or comparable mission-critical infrastructure.
Education
MS or higher in mechanical engineering, applied physics, or related field focused on heat transfer, fluid dynamics, and HVAC.

About the job

Owns thermal design, modeling, testing, and operational validation for expeditionary AI/HPC data center cooling systems.

What you'll do

  • Design cooling architectures across rack, chip, and facility levels, including air-side and liquid cooling and heat rejection.
  • Model and analyze system performance, then lead prototype builds, field testing, commissioning, and operational validation.
  • Conduct thermal trade studies and failure analysis, and present technical status to internal and customer reviews.

What they ask for

  • MS or higher in mechanical engineering, applied physics, or a related field focused on heat transfer, fluid dynamics, and HVAC.
  • In-depth understanding of heat transfer and fluid dynamics; experience with steady-state and transient thermal-system modeling, including HVAC and refrigerant simulations.
  • Full-spectrum data center thermal experience, including cooling, heat rejection, chilled water plant design, power density management, and liquid cooling; experience validating and testing data center thermal equipment.
  • CAD experience with Siemens NX or SolidWorks.

Nice to have

  • Python or MATLAB coding; thermal FEA/CFD experience with STAR-CCM+, ANSYS, Icepak, or FloEFD.
  • Experience with modular or ruggedized data centers in austere environments; ability to obtain and hold a U.S. Secret security clearance.

Pay

$161,000 — $212,000 USD base salary

Tools

MATLAB, Python, Siemens NX, SolidWorks, STAR-CCM+, ANSYS, Icepak, FloEFD

AI focus

Thermal management for expeditionary AI/HPC data centers and high-density compute.

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 6, 2026 (UTC)