Apple
IC Package Design Engineer
$175K–$325K
Austin Metro Area, Texas +2 · Full-time · Posted Sep 22, 2026
- Location
- Austin Metro Area, Texas
Los Angeles Metro Area, California
San Francisco Bay Area, California - Experience
- 10+ years of relevant industry experience.
- Education
- BS
About the job
Design and integrate advanced semiconductor package layouts, validate SI/PI performance, and improve design methods through automation and AI.
What you'll do
- Own package, SiP, and module physical design from concept through tape-out, including substrate layout.
- Perform RLGC parasitic extraction and S-parameter modeling to validate SI/PI performance targets.
- Coordinate package feasibility and system co-optimization, and improve CAD and automated design and verification flows.
What they ask for
- BS degree.
- 10+ years of relevant industry experience.
Nice to have
- IC package design experience with Cadence Allegro or Mentor Xpedition, package types such as SiP, PoP, and wirebond, and verification tools such as Calibre or CAM350.
- High-speed layout and SI/PI analysis experience; manufacturing and materials knowledge; Unix/Linux and scripting skills in Python, Perl, or TCL.
Pay
$175,000 and $308,500 USD base salary; $184,700 and $324,800 USD base salary
Tools
Cadence Allegro, Mentor Xpedition, Calibre, CAM350, HFSS, PowerSI, Python, Perl
AI focus
Use AI tools to enhance design efficiency, quality, and performance.
Model-written summary · the original posting is authoritative