Apple
IC Package Design Engineer
$123K–$225K
Austin Metro Area, Texas +2 · Full-time · Posted Sep 22, 2026
- Location
- Austin Metro Area, Texas
Los Angeles Metro Area, California
San Francisco Bay Area, California - Education
- Bachelor’s degree required.
About the job
Designs and integrates advanced semiconductor package layouts, validating SI/PI performance and improving design methods through automation and AI.
What you'll do
- Perform package substrate physical layout and validate designs using RLGC extraction and S-parameter modeling.
- Lead cross-functional package feasibility and system co-optimization with product design, architecture, and silicon/SIPI teams.
- Evaluate CAD tools and develop automated design and verification workflows.
What they ask for
- Bachelor’s degree required.
Nice to have
- IC package design experience with Cadence Allegro or Mentor Xpedition, package types such as SiP, PoP, and wirebond, and verification tools such as Calibre or CAM350.
- High-speed interface and SI/PI expertise; manufacturing and materials knowledge; Unix/Linux and scripting experience with Python, Perl, or TCL.
Pay
$122,700 and $214,300 USD base salary; $129,300 and $225,300 USD base salary
Tools
Cadence Allegro, Mentor Xpedition, Calibre, CAM350, HFSS, PowerSI, Python, Perl
AI focus
Expected to leverage AI tools to enhance design efficiency, quality, and performance.
Model-written summary · the original posting is authoritative