Apple
IC Package Integration Lead
$185K–$325K
San Francisco Bay Area, California +1 · Full-time · Posted Nov 17, 2025
- Location
- San Francisco Bay Area, California
Austin, Texas - Experience
- 10+ years of relevant industry experience.
- Education
- BS
About the job
Leads semiconductor package integration and technology development from concept through qualification and high-volume production.
What you'll do
- Lead package co-design and architecture with silicon, packaging, and systems teams, ensuring electrical, mechanical, thermal, reliability, and fit requirements are met.
- Drive package technology development and coordinate with assembly partners on development, NPI, qualification, and high-volume production.
- Create package design documentation, design rules, technical risk assessments, and checklists for development and production release.
What they ask for
- Bachelor’s degree and 10+ years of relevant industry experience.
Nice to have
- Experience in semiconductor packaging design, process, and technology development; managerial skills are highly desirable.
- Knowledge of advanced packaging, cross-functional packaging areas, and package layout tools such as Cadence APD/Allegro.
Pay
$184,700 to $324,800 USD base salary
Tools
Cadence APD/Allegro
Model-written summary · the original posting is authoritative