Apple
Memory Packaging Engineer
$129K–$225K
San Francisco Bay Area, California · Full-time · Posted Oct 29, 2026
- Experience
- Preferred: 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages.
- Education
- Bachelor's degree in a relevant field; MS or PhD preferred.
About the job
Defines, develops, and qualifies next-generation memory packages for Apple products, from architecture and vendor development through product qualification.
What you'll do
- Evaluate packaging technologies and define next-generation package architecture and the memory package plan of record.
- Collaborate with internal teams on electrical, mechanical, and thermal integration challenges.
- Drive vendor design of experiments and failure analysis to improve yield, quality, and reliability.
What they ask for
- Bachelor's degree in a relevant field.
- Strong knowledge of thin-die stacking technologies, including wirebond, flip-chip, and wafer/die bonding.
- Strong knowledge of packaging materials and design for warpage, CTE properties, and thermal challenges.
- Working experience in package test and reliability, downstream process interaction, and packaging inspection metrology.
Nice to have
- MS or PhD.
- Experience with SI/PI co-design, high-speed DDR or differential signaling, and collaboration with memory die design teams.
Pay
$129,300 and $225,300 (USD base salary range)
Tools
wirebond, flip-chip, wafer/die bonding, SI/PI, DDR
Model-written summary · the original posting is authoritative