Apple
Memory Packaging Engineer
$185K–$325K
San Francisco Bay Area, California · Full-time · Posted Oct 29, 2026
- Experience
- 10+ years of relevant industry experience; preferred qualification specifies 10+ years in package design and assembly process development for high-bandwidth, high-density memory packages.
- Education
- BS; MS or PhD preferred.
About the job
Defines, develops, and qualifies next-generation memory packages for Apple products, from architecture and vendor roadmaps through product qualification.
What you'll do
- Evaluate packaging technologies and define memory package architecture and plan of record, including form factor, process, layout, stackup, and bill of materials.
- Collaborate with internal engineering teams on electrical, mechanical, thermal, and system integration challenges.
- Drive vendor design of experiments, failure analysis, and development of package materials and technologies to improve yield, quality, and reliability.
What they ask for
- BS degree.
- 10+ years of relevant industry experience.
Nice to have
- MS or PhD; 10+ years of industry experience in package design and assembly process development for high-bandwidth, high-density memory packages.
- Knowledge of thin-die stacking, packaging materials and design, package test and reliability, inspection metrology, SI/PI co-design, and memory die architecture.
Pay
$184,700 and $324,800 USD base salary
Tools
wirebond, flip-chip, wafer/die bonding, DDR
Model-written summary · the original posting is authoritative