Apple
Package Integration Engineer
$185K–$325K
San Francisco Bay Area, California · Full-time · Posted Mar 17, 2026
- Experience
- 10+ years of relevant industry experience; preferred qualification specifies a minimum of 10 years of experience in IC packaging.
- Education
- BS; preferred: M.S. or Ph.D. in mechanical engineering, physics, materials science, or similar disciplines.
About the job
Develop and deploy custom silicon packaging solutions for consumer products, from package definition and design through qualification, reliability testing, and production ramp.
What you'll do
- Define package characteristics, specifications, and roadmaps based on product performance, cost, and footprint needs.
- Work with suppliers to develop package designs, materials, equipment, processes, and packaging technologies.
- Lead proof-of-concept builds, qualification, reliability testing, yield improvement, and delivery of packaging milestones.
What they ask for
- BS degree.
- 10+ years of relevant industry experience.
Nice to have
- M.S. or Ph.D. in mechanical engineering, physics, materials science, or a similar discipline, with a minimum of 10 years of experience in IC packaging.
- AutoCAD, APD, and multi-physics simulation knowledge; hands-on wafer bumping and manufacturing assembly process knowledge.
Pay
$184,700 and $324,800 (base salary)
Tools
AutoCAD, APD, Wafer Level Chip Scale Packaging, RDL/Wafer Bumping, BEOL Assembly
Model-written summary · the original posting is authoritative