Apple
Packaging Engineer
$185K–$325K
San Francisco Bay Area, California · Full-time · Posted Aug 24, 2026
- Experience
- 10+ years of relevant industry experience; preferred qualification specifies a minimum of 10 years of experience in IC packaging.
- Education
- BS; preferred: M.S. or Ph.D. in mechanical engineering, physics, materials science, or similar disciplines.
About the job
Develop and qualify custom silicon packaging solutions for consumer products, from package design and supplier development through high-volume manufacturing.
What you'll do
- Define package characteristics, specifications, and long-term packaging roadmaps based on performance, cost, and footprint needs.
- Work with suppliers on package design, materials, equipment, process development, and supplier R&D.
- Lead proof-of-concept builds, qualification, reliability testing, yield analysis, and delivery of packaging milestones.
What they ask for
- BS degree and 10+ years of relevant industry experience.
- Hands-on knowledge of wafer bumping and dielectric materials, including their pros and cons.
- Knowledge of package qualification, reliability testing, and common reliability failure modes.
- Track record of bringing products or packages from concept through development into high-volume manufacturing.
Nice to have
- M.S. or Ph.D. in mechanical engineering, physics, materials science, or a similar discipline; AutoCAD, APD, and multi-physics simulation knowledge.
- WLP industry experience; hands-on knowledge of manufacturing assembly processes and wafer-level chip-scale packaging.
Pay
$184,700 and $324,800 USD base salary
Tools
AutoCAD, APD, WLP, Wafer Bumping, Dielectric materials, Flip Chip, RDL, Tape & Reel
Model-written summary · the original posting is authoritative