Apple
Packaging Substrate Engineer
$185K–$325K
Austin Metro Area, Texas +1 · Full-time · Posted Oct 26, 2026
- Location
- Austin Metro Area, Texas
San Francisco Bay Area, California - Experience
- 10+ years of relevant industry experience with a BS; alternatively, preferred qualifications state 8+ years with an MS or Ph.D.
- Education
- BS; MS or Ph.D. preferred.
About the job
Leads development and optimization of package substrate technologies and architectures for Apple products, taking solutions from concept through high-volume manufacturing (HVM).
What you'll do
- Define substrate technology development, pathfinding, and roadmap; optimize package architectures with cross-functional teams.
- Partner with substrate manufacturers, foundries, and OSATs to develop solutions from concept to HVM.
- Resolve technical issues across the product development cycle and drive architecture, materials, process, and specification development.
What they ask for
- BS and 10+ years of relevant industry experience.
- Fundamentals in materials, chemistry, or mechanical engineering.
- In-depth knowledge of substrate technology, manufacturing processes, design rules, and roadmaps.
- Hands-on substrate manufacturing and technology development experience, such as Cu plating, lithography, dielectric material, via formation, solder resist, or surface finish.
Nice to have
- MS or Ph.D. and 8+ years of relevant industry experience.
- Familiarity with package assembly and integration; Cadence Allegro and design review for manufacturing (DFM) experience.
Pay
$184,700 and $324,800 (base salary range; USD)
Tools
Cu plating, lithography, dielectric material, via formation, solder resist, surface finish, Cadence Allegro, OSAT
Model-written summary · the original posting is authoritative