Apple
Substrate Technologist
$123K–$225K
San Francisco Bay Area, California +2 · Full-time · Posted Oct 28, 2026
- Location
- San Francisco Bay Area, California
Irvine, California
San Diego, California - Education
- Bachelor's degree required; MS or Ph.D. preferred.
About the job
Leads development, optimization, and manufacturing integration of package substrates for Apple hardware packaging products.
What you'll do
- Develop substrate technologies and roadmaps, taking solutions from concept to high-volume manufacturing (HVM).
- Define and optimize package substrate architectures with cross-functional teams, balancing performance, technical risk, cost, and availability.
- Resolve technical issues throughout product development and work with industry partners on materials, specifications, and package solutions.
What they ask for
- Bachelor's degree required.
Nice to have
- MS or Ph.D. and relevant industry experience; fundamentals in materials, chemistry, or mechanical engineering.
- In-depth substrate technology and manufacturing knowledge; hands-on experience with Cu plating, Lithography, Dielectric material, Laser via formation, or Solder resist; package assembly/integration familiarity; Cadence Allegro and design review for manufacturing (DFM) experience.
Pay
USD $122,700 to $214,300 base salary; USD $129,300 to $225,300 base salary
Tools
Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, Cadence Allegro
Model-written summary · the original posting is authoritative