Apple
Substrate Technologist
$175K–$325K
San Francisco Bay Area, California +2 · Full-time · Posted Jun 4, 2026
- Location
- San Francisco Bay Area, California
Irvine, California
San Diego, California - Experience
- Minimum: 10+ years of relevant industry experience with a BS. Preferred: 5+ years of relevant industry experience with an MS or Ph.D.
- Education
- BS; MS or Ph.D. preferred.
About the job
Leads substrate technology development and package architecture optimization for Apple hardware packaging, from concept through high-volume manufacturing (HVM).
What you'll do
- Drive RFSIP substrate development, technology pathfinding, and roadmap definition with industry partners.
- Define and optimize package substrate architectures with cross-functional teams, considering performance, risk, cost, and availability.
- Resolve technical issues throughout product development and advance substrate materials, specifications, and manufacturing solutions.
What they ask for
- BS and 10+ years of relevant industry experience.
- Proven fundamentals in materials, chemistry, or mechanical engineering.
- In-depth knowledge of substrate technology, manufacturing processes, design rules, and roadmaps.
- Hands-on experience in substrate manufacturing and technology development.
Nice to have
- MS or Ph.D. and 5+ years of relevant industry experience.
- Familiarity with package assembly and integration, Cadence Allegro platform tools, and design review for manufacturing (DFM).
Pay
$175,000 and $308,500 (USD, base salary); $184,700 and $324,800 (USD, base salary)
Tools
Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, Cadence Allegro
Model-written summary · the original posting is authoritative