Drimva

Astera Labs

Packaging Engineer Intern

San Jose, CA +1 · Internship · Posted Aug 27, 2026

Location
San Jose, CA
California
Education
Working toward an M.S. or PhD in Electrical Engineering or a related field.

About the job

Supports semiconductor package design, simulation, documentation, and manufacturing readiness for connectivity products.

What you'll do

  • Support package design, modeling, automation, and documentation, including SI/PI, thermal, and mechanical analyses.
  • Organize package requirements and maintain design records; review layouts and support tape-out and manufacturing-readiness activities.
  • Document and present analysis results, risks, and recommendations while collaborating with internal teams and suppliers.

What they ask for

  • Working toward an M.S. or PhD in Electrical Engineering or a related field.
  • Cumulative GPA of 3.3/4.0 or higher.
  • Coursework in RF/microwave, communication systems and signal analysis, semiconductor manufacturing, or circuit design.
  • Scripting or software-development experience in Python, Visual Basic, or equivalent programming languages.

Nice to have

  • Experience with physical-design or layout tools such as AutoCAD, Cadence Allegro, Cadence APD/SiP, or comparable tools.
  • Experience using 3D electromagnetic-simulation tools such as ANSYS Electronics Desktop, HFSS, HFSS 3D Layout, or SIwave.

Pay

$35/hour to $55/hour (hourly rate); $500-per-week (housing/relocation stipend)

Tools

Python, Visual Basic, AutoCAD, Cadence Allegro, Cadence APD/SiP, ANSYS Electronics Desktop, HFSS 3D Layout, Keysight ADS

Model-written summary · the original posting is authoritative

First seen Oct 29, 2026 · Last verified Nov 4, 2026 (UTC)