Astera Labs
Senior Packaging Integration Lead
San Jose, California, United States +1 · Senior · Full-time · Posted Sep 22, 2026
- Location
- San Jose, California, United States
California - Experience
- 5-7+ years; no stated alternatives.
- Education
- B.S. or M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related discipline.
About the job
Owns end-to-end packaging architecture and execution for advanced connectivity products, from customer requirements and technology selection through qualification and production ramp.
What you'll do
- Translate customer requirements into package architectures, specifications, and execution roadmaps; serve as the primary packaging interface to customers.
- Define package and test-vehicle strategies, make technology trade-offs, and drive qualification and manufacturability.
- Lead alignment across internal teams and OSAT, foundry, and substrate partners; communicate risks and decisions to stakeholders.
What they ask for
- B.S. or M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related discipline.
- 5-7+ years of experience in advanced packaging technologies such as 2.5D/3D integration, TSV, chiplets, and interposers.
- Demonstrated end-to-end ownership of a packaging solution from definition and architecture through qualification and production ramp.
- Experience defining package architecture and technology selection, test-vehicle and qualification strategies, and translating customer requirements into package specifications.
Nice to have
- Experience with UCIe / die-to-die interconnect, high-bandwidth chiplet integration, CoWoS-class, silicon-bridge, advanced fan-out, or co-packaged optics.
- Advanced degree preferred; optical / co-packaged optics experience is a plus.
Tools
2.5D/3D integration, TSV, chiplets, interposers, CoWoS-class, UCIe, SIPI, OSAT
Model-written summary · the original posting is authoritative