Astranis
Mechanical Engineer, Electronics Packaging & RF Components
$110K–$160K
San Francisco +1 · Full-time · Posted Oct 31, 2023
- Location
- San Francisco
San Francisco, California, United States - Experience
- 2+ years.
- Education
- B.S. or M.S in mechanical, aerospace engineering or equivalent.
- Visa sponsorship
- Applicant must be a U.S. citizen, lawful permanent resident of the United States, or other protected individual as defined by 8 U.S.C. 1324b(a)(3).
About the job
Designs, analyzes, builds, and tests spacecraft electronics enclosures and RF components across the hardware lifecycle, addressing mechanical, thermal, electromagnetic, and launch-environment needs.
What you'll do
- Design, analyze, build, and test electronics enclosures, RF housings, and PCBA mounts, including RF isolation and EMI shielding.
- Collaborate with RF, Electrical, and Systems teams on mechanical requirements, interfaces, signal integrity, and environmental loads.
- Integrate electronics units into spacecraft designs, optimizing assembly procedures, wire routing, and thermal interface material application.
What they ask for
- B.S. or M.S in mechanical, aerospace engineering or equivalent.
- 2+ years of experience in mechanical design focused on electronics packaging, RF packaging, or enclosure design.
- Proficiency in mechanical 3D CAD (e.g., SolidWorks, NX, or Creo).
- Strong mechanical, structural, and thermal design fundamentals, plus practical RF isolation and EMI/EMC mitigation knowledge.
Nice to have
- Experience designing high-frequency (Ku-Band or higher) RF/microwave enclosures, waveguides, or filter housings.
- Experience with mechanical and/or thermal FEA (e.g., ANSYS, Femap/NX Nastran, Thermal Desktop).
Pay
$110,000 — $160,000 USD (base salary)
Tools
SolidWorks, NX, Creo, ANSYS, Femap/NX Nastran, Thermal Desktop
Model-written summary · the original posting is authoritative