Astranis
Senior Mechanical Engineer, Electronics Packaging & RF Components
$145K–$225K
San Francisco +1 · Senior · Full-time · Posted Apr 13, 2023
- Location
- San Francisco
San Francisco, California, United States - Experience
- 5+ years in mechanical design focused on electronics packaging, RF packaging, or enclosure design.
- Education
- B.S. or M.S. in mechanical or aerospace engineering, or equivalent.
- Visa sponsorship
- U.S. citizenship, lawful permanent residency, or refugee/asylee status required.
About the job
Designs, analyzes, builds, and tests spacecraft electronics enclosures and RF components across the hardware lifecycle, working with engineering teams to address mechanical, thermal, electrical, and RF requirements.
What you'll do
- Design, analyze, build, and test space-grade electronics enclosures, RF housings, and PCBA mounts, including RF isolation and EMI shielding.
- Collaborate with RF, Electrical, and Systems teams to define mechanical constraints, connector interfaces, signal integrity, and environmental loads.
- Integrate electronics units into spacecraft designs and develop assembly, wire-routing, and thermal-interface procedures.
What they ask for
- B.S. or M.S. in mechanical or aerospace engineering, or equivalent.
- 5+ years of mechanical design experience focused on electronics packaging, RF packaging, or enclosure design.
- Proficiency in mechanical 3D CAD, such as SolidWorks, NX, or Creo.
- Strong mechanical, structural, and thermal design fundamentals, plus practical RF isolation and EMI/EMC mitigation knowledge.
Nice to have
- Experience with high-frequency (Ku-Band or higher) RF/microwave enclosures, waveguides, or filter housings.
- Experience with mechanical and/or thermal FEA, such as ANSYS, Femap/NX Nastran, or Thermal Desktop.
Pay
$145,000 — $225,000 USD (base salary)
Tools
SolidWorks, NX, Creo, ANSYS, Femap/NX Nastran, Thermal Desktop
Model-written summary · the original posting is authoritative