Broadcom
ASIC Package Design Project Manager
USA-Colorado-Fort Collins-4380 Ziegler Road · Manager · Full-time · Posted Sep 21, 2026
- Experience
- 12+ years of related experience with a Bachelor’s degree; or 10+ years with a Master’s degree.
- Education
- Bachelor’s degree or Master’s degree; no equivalent-experience alternative stated.
About the job
Leads project management for teams designing complex flip-chip-BGA packages for ASICs, while contributing to package-design methodologies and technology.
What you'll do
- Create and track plans for 20+ concurrent designs, including scope, schedules, and resources; improve scheduling and task coordination.
- Coordinate team, customer, vendor, and cross-functional activities; communicate project status, next steps, and risks.
- Develop package-design methodologies and help steer package technology and design rules.
What they ask for
- Bachelor’s degree and 12+ years of related experience, or a Master’s degree and 10+ years of related experience.
- Knowledge of package-level signal integrity and power integrity, applied to package designs.
- Technical understanding of package design, including its lifecycle, ASIC and manufacturing flows, design data, DFx trade-offs, layout, SI/PI extraction and simulation, automation code development, and mechanical and thermal modeling.
- Able to work on-site at the Broadcom office 5 days a week; occasional travel may be required.
Nice to have
- Previous experience managing package-design projects.
Tools
flip-chip-BGA, SerDes, 5G RF/Microwave ADC/DAC, HBM, DDR5, .mcm, POD
AI focus
Package design for ASICs used in artificial intelligence (AI) applications.
Model-written summary · the original posting is authoritative