Broadcom
IC Package Mechanical FEA Engineer (R&D)
$108K–$173K
USA-Colorado-Fort Collins-4380 Ziegler Road +1 · Full-time · Posted Jun 2, 2026
- Location
- USA-Colorado-Fort Collins-4380 Ziegler Road
USA-CA San Jose Innovation Drive - Experience
- Bachelor's degree: 8+ years of FEA modeling; Master's degree: 6+ years; PhD: 3+ years.
- Education
- Bachelor's, Master's, or PhD in Mechanical Engineering or a similar field.
About the job
Designs and validates mechanical aspects of complex ASIC packages using FEA, collaborating with R&D, design, reliability, and manufacturing teams.
What you'll do
- Use advanced FEA to assess and optimize package reliability and manufacturability; validate models through measurement and experiments.
- Collaborate with package designers, reliability and manufacturing partners, and vendor designers across multiple projects.
- Document design rules and guidelines, and present findings to technical and business audiences.
What they ask for
- Evaluate numerical simulation results against first principles and calibrate models using empirical data.
- Perform mechanical testing and measurement, and devise lab-scale tests to validate analyses.
- Find mechanical solutions that balance manufacturing limits, reliability, and customer expectations.
- Coordinate work with a worldwide team across multiple time zones.
Nice to have
- Ansys Classic/Mechanical experience; equivalent tools are acceptable.
- Self-management, organization, presentation, and technical documentation skills.
Pay
$108,000 - $172,800 USD annual base salary
Tools
FEA, Ansys Classic/Mechanical, ASIC, 3DIC, hybrid copper bonding, MCM, FCBGA
AI focus
Develops high-performance ASIC package designs for AI applications.
Model-written summary · the original posting is authoritative