Broadcom
Principal Die-to-Die Interconnect Modeling Architect
$168K–$268K
USA-CA San Jose Innovation Drive +1 · Principal · Full-time · Posted Oct 8, 2026
- Location
- USA-CA San Jose Innovation Drive
USA-Colorado-Fort Collins-4380 Ziegler Road - Experience
- 15 or more years with an MS; or 12 or more years with a PhD.
- Education
- MS in Electrical Engineering or Computer Engineering; or PhD in Electrical Engineering or Computer Engineering.
About the job
Leads development of system-level modeling and verification for die-to-die PHYs, predicting link performance and correlating models with RTL and silicon.
What you'll do
- Develop behavioral and architectural models to predict link performance, including timing, margins, power, and other system metrics.
- Lead architectural verification, algorithm evaluation, and correlation among models, RTL, laboratory characterization, and silicon.
- Provide technical leadership across engineering teams, guide technical decisions, and mentor engineers and architects.
What they ask for
- MS in Electrical Engineering or Computer Engineering and 15 or more years of related field experience; or PhD in Electrical Engineering or Computer Engineering and 12 or more years of related field experience.
- Deep understanding of communication theory, equalization, and adaptive algorithms.
- Experience in high-speed SerDes or D2D communication systems architecture.
- Experience developing behavioral and architectural models using MATLAB, Python, SystemC, or equivalent tools; experience with architecture model to RTL to verification and leading architectural verification, silicon correlation, and performance validation across multidisciplinary teams.
Nice to have
- Expertise in D2D, UCIe, or other short-reach die-to-die communication.
- Expertise in advanced packaging, or management experience.
Pay
USD 167,500.00 To USD 268,000.00 (base salary)
Tools
MATLAB, Python, SystemC, Verilog, RTL
Model-written summary · the original posting is authoritative