Broadcom
R&D Engineer
$168K–$268K
USA-CA San Jose Innovation Drive · Full-time · Posted Jun 17, 2026
- Experience
- 15+ years with an MSEE, or 12+ years with a PhD, in semiconductor process technology and manufacturing, specifically R&D and integration roles.
- Education
- MSEE in Electrical Engineering or related field, or PhD.
About the job
Leads advanced packaging and assembly technology development for multi-chip AI and high-performance computing modules, from R&D through product introduction and manufacturing transfer.
What you'll do
- Lead multi-chip semiconductor assembly and system technology pathfinding and roadmaps.
- Define technology requirements, evaluation and qualification plans, and provide hands-on support as technologies move into product development.
- Manage technology projects, coordinate internal and external teams, and assess and mitigate risks across projects.
What they ask for
- Broad knowledge of advanced packaging, assembly, and silicon process technologies, including thermal solutions, power delivery, and electrical and optical communication.
- Experience designing serial and parallel interfaces for chip-to-chip and external module communication.
- Experience with parametric and yield data analysis, statistical analysis tools, failure analysis tools (EFA, PFA), and thermal and stress simulation tools.
- MSEE in Electrical Engineering or related field and 15+ years of relevant experience, or PhD and 12+ years of relevant experience.
Pay
$167,500 - $268,000 USD base salary
Tools
EFA, PFA
AI focus
Develops advanced packaging and assembly technologies for artificial intelligence modules.
Model-written summary · the original posting is authoritative