Advanced Packaging Design Engineering Team Leader (Hybrid)

What you'll do

• Lead complex package design programs, including schedules, optimization, and execution through tapeout.
• Guide package design choices such as pinouts, stack-ups, power distribution, and high-speed routing; coordinate with layout, SI/PI, silicon architecture, manufacturing, and vendors.
• Lead, mentor, and grow the San Jose team while improving design methodologies and coordinating project resources.

What they ask for

• Bachelor’s degree in electrical engineering or a related field with 12+ years of work experience, or a Master’s degree in Electrical Engineering or a related field with 8+ years of work experience.
• Experience in high-speed package design, including signal integrity considerations and power distribution networks (PDN).
• Experience with industry-standard EDA tools for package layout and design.
• Experience with technical leadership in complex hardware or silicon development programs.

Nice to have

• Extensive ASIC package design experience, including pinout optimization and high-speed routing; knowledge of silicon floor planning and collaboration with SI and PI teams.
• Experience mentoring engineering teams, coordinating cross-functional hardware programs, testing and measurement equipment, or scripting languages.

Pay

$214,100.00 to $309,800.00 USD base salary; $214,100.00 - $356,300.00 USD base salary (New York City Metro Area); $192,400.00 - $317,200.00 USD base salary (Non-Metro New York state & Washington state)

Tools

EDA tools, Python, Perl, TCL, shell programming, oscilloscopes, TDR/VNA analyzers