Drimva

Cisco

Photonic Packaging Engineer

$136K–$259K

Carlsbad, California, US · Onsite Only · Full-time · Posted Oct 2, 2026

Experience
Bachelor’s + 7 years, or Master’s + 4 years, or PhD + 1 year of related experience.
Education
Bachelor’s, Master’s, or PhD.

About the job

Develops photonic packaging platforms, subassemblies, and electromechanical prototypes for Silicon Photonics products, while automating assembly and using analytics to improve manufacturing.

What you'll do

  • Develop packaging platforms, subassemblies, and electromechanical prototypes for Silicon Photonics integrated circuits and chipsets.
  • Automate assembly systems and use AI/ML and analytics to optimize high-volume manufacturing, simulate edge cases, and improve diagnostics.
  • Collaborate with global hardware, software, and manufacturing teams; support deployments and mentor engineers on AI-assisted tools.

What they ask for

  • Hardware/process automation experience.

Nice to have

  • Hardware/software automation of photonics assembly or test; machine vision in an automation environment.
  • Data analysis (SQL/JMP) in semiconductor production; C# on .NET; knowledge of photonics, fiber optics, and semiconductor lasers.

Pay

$136,500.00 to $198,500.00 USD base salary; $154,900.00 - $259,100.00 USD base salary; $136,500.00 - $228,300.00 USD base salary

Tools

AI/ML, SQL, JMP, C#, .NET

AI focus

Applies AI/ML and analytics to optimize high-volume manufacturing, simulate edge cases, improve diagnostics, and support engineers with AI-assisted tools.

Model-written summary · the original posting is authoritative

First seen Oct 16, 2026 · Last verified Nov 5, 2026 (UTC)