Drimva

Eliyan

Package & SI/PI - Signal and Power Integrity Engineer

Vancouver, BC OR Bay Area, CA · On-site · Full-time · Posted May 5, 2023

Experience
5 years; ideal qualification: 7 years with an MS degree in EE or equivalent.
Education
BS degree in EE or equivalent; ideal qualification: MS degree in EE or equivalent.

About the job

Designs, simulates, and tests packaging and signal/power integrity solutions for chiplet interconnects, working with circuit designers and layout engineers.

What you'll do

  • Define I/O requirements with analog circuit designers and simulate and optimize channels before and after layout.
  • Model power delivery networks and run DC, AC, and transient simulations.
  • Measure and debug designs in the lab, correlate results with simulations, and guide layout to meet manufacturing and assembly requirements.

What they ask for

  • Expertise in signal integrity and power integrity simulation methodologies.
  • Experience with simulation tools such as HFSS, Q3D, Siwave, PowerDC, PowerSI, ADS, Spectre, HSPICE, or Allegro.
  • Knowledge of lab equipment such as Vector Network Analyzer, Spectrum Analyzer, and High-Frequency Oscilloscope.
  • BS degree in EE or equivalent.

Nice to have

  • Previous experience in IC packaging, manufacturing, and advanced package design.
  • Knowledge of SERDES design and IBIS-AMI model creation.

Tools

HFSS, Q3D, Siwave, PowerDC, PowerSI, ADS, Spectre, HSPICE

Model-written summary · the original posting is authoritative

First seen Oct 29, 2026 · Last verified Nov 5, 2026 (UTC)