Etched
Substrate IC Package Layout Design Engineer
San Jose · On-site · Full-time · Posted Aug 27, 2026
- Experience
- 10+ years.
- Education
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
About the job
Designs and validates complex IC substrate packages for high-power AI processors and accelerators, with high-speed signaling and CoWoS integration.
What you'll do
- Lead large, multilayer substrate layout and power-delivery design for high-power silicon.
- Develop high-speed signal routing and collaborate with SI/PI, chip, packaging, and manufacturing teams.
- Validate designs with DRC and LVS, document guidelines, and support design reviews.
What they ask for
- 10+ years of IC substrate layout design for high-performance processors or accelerators.
- Experience with large (>50mm), high-density substrate packages and high-power (700W+) package designs.
- Expertise in >50GHz signaling and CoWoS interposer design.
- Advanced proficiency in Allegro Package Designer and deep understanding of SI/PI principles.
Tools
Allegro Package Designer, CoWoS, DRC, LVS
AI focus
Design substrate packages for high-power AI processors and accelerators; the company’s products focus on AI inference.
Model-written summary · the original posting is authoritative