Fab2
Packaging Engineering Intern - Summer
$108K–$126K
Austin · On-site · Internship · Posted Sep 5, 2026
- Experience
- At least 1-2 hands-on wet lab or lab-adjacent experiences; preferred internship commitment of 4 to 8 months.
- Education
- Pursuing a Bachelor’s Degree or higher in engineering.
- Visa sponsorship
- Visa Sponsorship
About the job
Develop and test semiconductor packaging technologies, equipment, and fabrication processes through hands-on prototyping, integration, and analysis.
What you'll do
- Design and iterate on machines and subsystems for semiconductor packaging fabrication; integrate mechanical, electrical, and optical components.
- Collaborate across teams to improve fabrication processes and equipment.
- Perform package and wafer processing, including 3D printing, metal plating, lithography, and metrology.
What they ask for
- Pursuing a Bachelor’s Degree or higher in engineering.
- At least 1-2 hands-on wet lab or lab-adjacent experiences.
- Strong foundation in mechanical engineering, including Solidworks/Onshape and materials selection.
- Hands-on prototyping experience and ability to move through design cycles quickly; a portfolio of things built is required to apply.
Nice to have
- Proven experience in mechatronics or electromechanical system design.
- Familiarity with lasering, 3D printing (stereolithography), reliability testing, soldering, reflow testing, or nano-fabrication and metrology tools.
Pay
USD 108,000–USD 126,000 annualized equivalent base pay
Tools
Solidworks/Onshape, 3d printing, metal plating, lasering, metrology, lithography, SEM
Model-written summary · the original posting is authoritative