Fab2
Packaging Engineering Intern - Winter
$108K–$126K
Austin · On-site · Internship · Posted Aug 27, 2026
- Experience
- At least 1-2 hands-on wet lab or lab-adjacent experiences; internship preferred commitment of 4 to 8 months.
- Education
- Pursuing a Bachelor’s Degree or higher in engineering.
- Visa sponsorship
- Visa Sponsorship
About the job
Develop and test semiconductor packaging fabrication equipment and processes through hands-on prototyping, system integration, and process development.
What you'll do
- Design and iterate on machines and subsystems for semiconductor packaging fabrication.
- Integrate mechanical, electrical, and optical components, including wiring, optics alignment, and electronics.
- Improve fabrication processes and equipment; perform package and wafer processing.
What they ask for
- Pursuing a Bachelor’s Degree or higher in engineering.
- At least 1-2 hands-on wet lab or lab-adjacent experiences.
- Strong foundation in mechanical engineering, including Solidworks/Onshape and materials selection.
- Hands-on prototyping experience and ability to move through design cycles quickly; a portfolio is required to apply.
Nice to have
- Proven experience in mechatronics or electromechanical system design.
- Familiarity with lasering and 3D printing (stereolithography).
Pay
USD 108,000–126,000 annualized equivalent base pay; actual earnings vary with hours worked. The posting also states: $108K – $126K • +Housing Stipend.
Tools
Solidworks/Onshape, 3d printing, metal plating, lasering, metrology, lithography, SEM, X-ray
Model-written summary · the original posting is authoritative