Advanced Packaging Development Engineer, Quantum AI
Goleta, CA, USA · Full-time · Posted Oct 5, 2026
- Experience
- 5 years in 3 specified packaging development areas; 5 years with one or more specified packaging technologies; 3 years delivering R&D concepts to a released product; 3 years developing advanced packaging solutions.
- Education
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP), or equivalent practical experience.
About the job
Develops and qualifies advanced packaging technologies that help scale superconducting quantum processors and related components.
What you'll do
- Design, implement, and characterize packaging platforms, materials, and processes.
- Develop process flows and Design-For-Integration principles; analyze and mitigate performance issues such as yield, reliability, and signal integrity.
- Work with external vendors and partners to evaluate, co-develop, and qualify next-generation packaging processes and components.
What they ask for
- Bachelor’s degree in a listed field or equivalent practical experience.
- 5 years of experience in 3 of these packaging development areas: simulation, layout and design, process engineering, assembly, test and measurement, or failure analysis.
- 5 years of experience with one or more of: 2.5D/3D integration, wafer level packaging, panel level packaging, or bump bonding.
- 3 years of experience delivering R&D concepts to a released product and 3 years developing advanced packaging solutions.
Nice to have
- Master's degree or PhD in a listed or related field.
- Semiconductor packaging experience; packaging simulation experience; or familiarity with quantum computing hardware architectures and packaging constraints.
Pay
$159000 - $230000 USD base salary
Tools
2.5D/3D integration, wafer level packaging, panel level packaging, bump bonding, Design-For-Integration (DfI)
Model-written summary · the original posting is authoritative