Staff Hardware Engineer, TPU Interconnect and Packaging
Sunnyvale, CA, USA · Staff · Full-time · Posted Oct 15, 2026
- Experience
- 10 years of experience in semiconductor packaging, integration, or interconnect design.
- Education
- Bachelor’s degree in Electrical Engineering, Materials Science, Optical Engineering, Microelectronics, a related technical field, or equivalent practical experience.
About the job
Leads technology roadmaps and cross-functional development of TPU interconnects and optical packaging, from architecture through production readiness.
What you'll do
- Define packaging architecture and technology selection for next-generation TPU systems.
- Drive electro-optical co-design and establish design rules for multi-chiplet assemblies.
- Partner with vendors and suppliers on process development, and lead qualification through mass production readiness.
What they ask for
- Bachelor’s degree in a related technical field or equivalent practical experience.
- 10 years of experience in semiconductor packaging, integration, or interconnect design.
- Experience with interconnect modeling, 2.5D/3D interposer design rules, or chiplet package assembly.
Nice to have
- Master's degree or PhD in a related technical discipline.
- Expertise in silicon photonics integration, Co-Packaged Optics (CPO), 2.5D silicon interposers, and high-density substrate routing.
Pay
$192000 - $278000 (USD) base salary
Tools
2.5D/3D interposers, embedded bridges, co-packaged optics (CPO), silicon photonics, OSAT
AI focus
Develops TPU interconnect and optical packaging technologies for AI accelerator systems.
Model-written summary · the original posting is authoritative