Drimva

HP IQ

Product Design Engineering Intern (Summer 2027)

San Francisco, CA +1 · Internship · Posted Oct 26, 2026

Location
San Francisco, CA
San Francisco, California, United States
Experience
Minimum 1–2 years of hardware product design or related experience is listed as a preferred skill.

About the job

Design and integrate mechanical and hardware systems for HP products, taking concepts through prototyping, validation, and production ramp.

What you'll do

  • Translate product vision into mechanical designs and integrate subsystems into a cohesive hardware architecture.
  • Create CAD models, placement studies, tolerance analyses, and design documentation to support manufacturing.
  • Collaborate with engineering teams, vendors, and manufacturers on prototypes, design validation, feasibility, and production issues.

What they ask for

  • Understand material science fundamentals, including stress-strain relationships, thermal properties, and material selection.
  • Be proficient with CAD tools and component placement in constrained form factors; understand tolerance analysis and design for manufacturability.
  • Have experience or demonstrated knowledge of manufacturing processes such as injection molding, CNC machining, extrusion, and assembly.
  • Have experience with PCB design, flexible PCB, or electrical component integration.

Nice to have

  • Minimum 1–2 years of hardware product design or related experience; consumer electronics internship preferred.
  • Experience with contract manufacturers or FATP partners, DOE or design validation, hardware project portfolios, assembly process design, or product development through production ramp.

Pay

$40.00–$50.00 per hour (hourly pay)

Tools

CAD, PCB, flexible PCB, injection molding, CNC machining, extrusion, FATP, DOE

AI focus

The role designs and integrates hardware products at HP IQ, an AI innovation lab; the posting does not specify direct AI development duties for this position.

Model-written summary · the original posting is authoritative

First seen Oct 29, 2026 · Last verified Nov 5, 2026 (UTC)