Drimva

HP

Software and Engineering Intern Roles - Imaging and Print

Corvallis, Oregon, United States of America · Internship · Posted Oct 1, 2026

Experience
No more than 24 months of professionally related work experience, excluding internships, teaching assistance, research work, and military experience.
Education
Third year of university completed or first year of master's completed; typically a technical degree specialization.
Visa sponsorship
Must be able to obtain US work authorization in 2027 and not require sponsorship in the future. HP will not provide immigration sponsorship assistance or sign documentation in support of CPT or OPT.

About the job

A 12-week paid summer internship across HP Imaging, Printing & Solutions, where students contribute to engineering projects in areas such as software, hardware, mechanical, quality, manufacturing, test, firmware, and data analytics.

What you'll do

  • Work on real-world engineering projects across the listed areas of interest.
  • Apply technical skills to testing, analysis, design, development, integration, or process improvement, depending on the role.
  • Document technical findings and communicate results or recommendations.

What they ask for

  • Completed third year of university or first year of a master's program, typically in a technical degree specialization.
  • No more than 24 months of professionally related prior work experience, excluding internships, teaching assistance, research work, and military experience.
  • Able to obtain US work authorization in 2027 and not require sponsorship in the future.

Nice to have

  • Project experience demonstrating analytical, modeling, and research skills.
  • Working knowledge of MS PowerPoint and MS Excel.

Pay

$29 to $35 per hour (USD, hourly pay)

Tools

Excel, JMP Statistical Software, Minitab, SolidWorks, Creo/ProEngineer, AutoCAD, MATLAB, Python

AI focus

Data science and analytics work may involve machine learning.

Model-written summary · the original posting is authoritative

First seen Oct 15, 2026 · Last verified Nov 5, 2026 (UTC)