Intel
3DIC Platform Wet and Plating Development Manager
$181K–$255K
US, Oregon, Hillsboro · Manager · Full-time · Posted Oct 8, 2026
- Experience
- 8+ years of relevant experience with a Master’s degree, or 6+ years with a PhD.
- Education
- Master or PhD degree in Chemistry, Materials Science, Physics, Electrical Engineering, Mechanical Engineering, or a related field.
About the job
Leads a team developing and optimizing wet etch/clean and plating processes for Intel’s 3DIC advanced packaging technologies, from development through high-volume manufacturing.
What you'll do
- Lead, coach, and develop process engineers while setting team goals and managing performance.
- Set process roadmaps and oversee production-worthy wet etch/plating development, yield improvement, and defect reduction.
- Manage project schedules and cross-functional technology transfer to high-volume manufacturing.
What they ask for
- Master’s or PhD in Chemistry, Materials Science, Physics, Electrical Engineering, Mechanical Engineering, or a related field.
- Wet Etch/Clean or Plating experience, including hands-on work with wet etch and/or plating platforms.
- Project management experience, including schedules, deliverables, and cross-functional collaboration.
Nice to have
- Experience with vendor relations, material quality assessments, and performance management.
- Knowledge of Design of Experiments (DOE), problem-solving methodologies, and package interconnect technologies.
Pay
$180,770.00-255,200.00 USD (base salary)
Tools
Wet Etch/Clean, Plating, Design of Experiments (DOE), Foveros Direct, Foveros, EMIB
Model-written summary · the original posting is authoritative