Intel
Advanced Packaging Development Engineer
$134K–$189K
US, Arizona, Phoenix · Full-time · Posted Oct 26, 2026
- Experience
- 3+ years with a bachelor's degree; 2+ years with a master's degree; no prior professional experience with a PhD. Also requires process development and/or equipment qualification experience.
- Education
- Bachelor's, master's, or PhD in Engineering, Physics, Chemistry, or a related STEM field.
About the job
Develops and qualifies semiconductor packaging processes, materials, and equipment for reliability, manufacturability, yield, quality, and cost in development and high-volume manufacturing.
What you'll do
- Develop, optimize, and qualify packaging assembly processes, materials, and equipment; establish process specifications and material requirements.
- Use experimental design and process-control methods to improve processes and address reliability and manufacturability challenges.
- Collaborate with teams and suppliers, support equipment and process health, and document technical findings and improvements.
What they ask for
- Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field and 3+ years of industry experience; or a master's degree in one of these fields and 2+ years of industry experience; or a PhD in one of these fields with no prior professional experience.
- Experience with process development and/or equipment qualification for manufacturing applications.
Nice to have
- Experience leading technical teams and working across matrixed organizations; semiconductor fabrication, packaging, or assembly experience.
- Experience with SPC, DOE, process characterization, quality systems, packaging reliability evaluation, or programming in Python, MATLAB, or SQL.
Pay
$133,800.00-188,890.00 USD (base salary)
Tools
Statistical Process Control (SPC), Design of Experiments (DOE), Python, MATLAB, SQL
Model-written summary · the original posting is authoritative