Intel
Advanced Packaging Module Development Engineer
$134K–$255K
US, Oregon, Hillsboro · Full-time · Posted Sep 25, 2026
- Experience
- 4+ years of relevant industry experience with a master’s degree; or 3+ years with a PhD. Preferred qualifications include 4+ years in listed areas.
- Education
- Master’s or PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field.
About the job
Develops and integrates semiconductor manufacturing processes and equipment for high-volume production and future device technologies, including advanced packaging.
What you'll do
- Design and develop manufacturing processes, optimizing materials, parameters, metrology, and equipment.
- Develop technology roadmaps and assess future processes through feasibility studies and pathfinding.
- Improve manufacturing output and efficiency with suppliers and internal teams, using statistical methods and automation.
What they ask for
- Master’s degree in a listed or related field plus 4+ years of relevant industry experience, or a PhD in a listed or related field plus 3+ years of relevant experience.
- Relevant technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems; or hands-on experience with robotics, automation, vision systems, or image processing.
Nice to have
- 4+ years of experience with SPC and DOE, Python or MATLAB, manufacturing troubleshooting, packaging or automation, project management, semiconductor device physics, or advanced packaging technologies.
Pay
$133,800.00-255,200.00 USD (target compensation; not specified as base salary or total pay)
Tools
Statistical Process Control (SPC), Design of Experiments (DOE), Python, MATLAB, robotics, automation systems, vision systems, image processing
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