Intel
Advanced Packaging Substrate Supplier Enablement Lead
$164K–$232K
US, Arizona, Phoenix · Full-time · Posted Sep 22, 2026
- Experience
- 9+ years with a bachelor's degree, 6+ years with a master's degree, or 4+ years with a PhD; experience should include process integration and advanced packaging, substrate, or semiconductor process development.
- Education
- Bachelor's, master's, or PhD in engineering, physics, materials science, or a related field.
About the job
Leads advanced packaging substrate supplier development and qualification, enabling manufacturing capacity and readiness for new technologies and customer demand.
What you'll do
- Define process integration roadmaps and manufacturing procedures to meet technology transfer milestones.
- Lead yield analysis, corrective actions, and continuous improvement to improve quality and process reliability.
- Assess manufacturing change risks and align process strategies with internal teams and supplier stakeholders.
What they ask for
- Proficiency in process integration methodologies and tools used in semiconductor manufacturing environments.
- Experience in advanced packaging, substrates, or semiconductor process development.
- Strong structured problem-solving and data-driven decision-making skills.
- Supplier management and technology enablement leadership.
Pay
$164,100.00-231,670.00 USD (target compensation; type not specified)
Model-written summary · the original posting is authoritative