Intel
Advanced Packaging TD Plating Module Engineer
$134K–$255K
US, Oregon, Hillsboro · Full-time · Posted Oct 8, 2026
- Experience
- Master's: 4+ years of relevant experience; PhD: 2+ years of relevant experience. Also requires 2+ years in semiconductor processing or advanced packaging technology development and related process development, control, or improvement work.
- Education
- Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field; OR PhD in the same fields.
About the job
Develops and optimizes advanced packaging plating and other manufacturing processes to support next-generation semiconductor architectures and high-volume production.
What you'll do
- Develop and optimize manufacturing processes, including material selection, equipment metrology, and system design.
- Conduct feasibility studies and simulations; use process controls and data analytics to improve stability, efficiency, and scalability.
- Collaborate with suppliers and cross-functional teams on process innovation, integration, and technology roadmaps.
What they ask for
- Master's degree in a listed or related STEM field and 4+ years of relevant experience, or PhD in those fields and 2+ years of relevant experience.
- 2+ years of experience in semiconductor processing or advanced packaging technology development and process development methodologies, statistical process control, or manufacturing process improvements.
Nice to have
- Expertise in plasma etch, plating processes, or thin-film deposition.
- Experience in wafer-level assembly, hybrid bonded interconnects, or advanced packaging technologies.
Pay
$133,800.00-255,200.00 USD (base salary)
Tools
plasma etch, plating processes, thin-film deposition, statistical process control
Model-written summary · the original posting is authoritative