Intel
Defect Characterization Low Yield Analysis Engineer
$134K–$189K
US, Arizona, Phoenix · Full-time · Posted Oct 7, 2026
- Experience
- 3+ years with a Master’s degree; no years stated for the PhD alternative.
- Education
- Master’s Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry and Physics, or related field; OR PhD in one of these fields or a related field.
About the job
Leads defect and low-yield investigations for advanced packaging and substrate programs, identifies root causes, and drives yield and process improvements.
What you'll do
- Lead investigations and define characterization methods to resolve yield, defect, and quality issues.
- Analyze characterization results and manufacturing data to determine root causes and yield trends; develop tools and analytics to improve efficiency.
- Drive corrective actions across teams, present findings, and mentor engineers and technicians.
What they ask for
- Master’s degree in a listed or related field and 3+ years of relevant semiconductor industry or failure analysis lab experience, or a PhD in a listed or related field.
- Experience independently driving technical investigations and root cause analysis.
- Ability to manage competing priorities and communicate technical findings to diverse audiences.
- Ability to work on-site in a lab-based role.
Nice to have
- Hands-on failure analysis and characterization experience, including sample preparation techniques.
- Experience with semiconductor packaging or related process technologies, statistical/data analytics, or mentoring.
Pay
$133,800.00-188,890.00 USD (annual salary; base salary)
Tools
Optical Microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, Python
Model-written summary · the original posting is authoritative