Drimva

Intel

Die Sort Module Engineer

$104K–$146K

US, New Mexico, Albuquerque · Full-time · Posted Oct 28, 2026

Experience
Bachelor's: 3+ years; master's degree or PhD: 2+ years in semiconductor device fabrication or semiconductor manufacturing.
Education
Bachelor's degree or master's degree or PhD in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a related technical discipline.
Visa sponsorship
Not eligible for Intel immigration sponsorship.

About the job

Maintains and improves semiconductor die-sort equipment and processes to support safe, reliable, high-volume production.

What you'll do

  • Troubleshoot, maintain, and optimize sort equipment, including preventive maintenance, process monitoring, data analysis, and excursion response.
  • Develop and optimize recipes and process solutions; transfer new processes and technologies with partner teams.
  • Analyze root causes and implement improvements to safety, quality, equipment availability, yield, and manufacturing performance.

What they ask for

  • Bachelor's degree in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a related technical discipline, plus 3+ years of semiconductor device fabrication or semiconductor manufacturing experience; OR a master's degree or PhD in one of these fields, plus 2+ years of that experience.
  • Hands-on experience with semiconductor process and equipment troubleshooting, repair, and/or development.
  • Experience with statistical process control methodologies and engineering analysis tools.
  • Proficiency in model-based problem-solving and root-cause analysis, including MBPS, DOE, FMEA, or equivalent approaches.

Nice to have

  • Data fluency in extraction, visualization, statistical analysis, and interpretation.
  • Previous Sort/Test experience.

Pay

$103,730.00-146,440.00 USD (annual target compensation; base salary or total pay not specified)

Tools

MBPS, DOE, FMEA

Model-written summary · the original posting is authoritative

First seen Oct 29, 2026 · Last verified Nov 4, 2026 (UTC)