Intel
Member of Technical Staff - Thin Films Engineer
$134K–$255K
US, Oregon, Hillsboro · Staff · Full-time · Posted Oct 21, 2026
- Experience
- 5+ years in the semiconductor industry focused on thin-film deposition processes, or a PhD and 3+ years of industry experience.
- Education
- Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a STEM-related field.
About the job
Leads development, optimization, and manufacturing transfer of thin-film deposition processes for Intel semiconductor technology nodes, improving yield, quality, throughput, and cost.
What you'll do
- Optimize thin-film processes and equipment performance to improve defectivity, uniformity, yield, throughput, and cost.
- Lead technical problem resolution and manufacturing challenges across engineering disciplines and partner organizations.
- Collaborate with development, manufacturing, business groups, and suppliers; communicate findings and contribute to technology roadmaps.
What they ask for
- Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a STEM-related field.
- 5+ years of semiconductor industry experience focused on thin-film deposition, or a PhD and 3+ years of industry experience.
- Experience in process development, technical leadership, manufacturing engineering, and equipment supplier process optimization.
- Fab startup experience; proficiency with SPC, DOE, and factory automation systems.
Nice to have
- Doctoral degree with thin-film technology research publications and patent portfolio.
- GAA logic expertise, semiconductor foundry experience, or a track record delivering customized solutions across Technology Development and HVM.
Pay
$133,800.00-255,200.00 USD (target compensation; salary type not specified)
Tools
CVD, ALD, PVD, SPC, DOE, AMAT, LAM, ASM
Model-written summary · the original posting is authoritative