Intel
Module Development Engineer - LTD Dry Etch
$134K–$255K
US, Oregon, Hillsboro · Full-time · Posted Sep 11, 2026
- Experience
- PhD route: relevant industry or graduate school research experience; master's route: 2 years of relevant industry or graduate school research experience; bachelor's route: 4+ years of industry experience at a leading foundry or dry etch equipment supplier. Preferred: 4+ years of direct industry dry etch process development experience.
- Education
- PhD, master's, or bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field.
About the job
Develops and qualifies dry etch patterning processes and equipment solutions for future semiconductor technologies and high-volume manufacturing.
What you'll do
- Develop, optimize, characterize, and qualify dry etch processes; conduct feasibility studies and experiments.
- Resolve process and defect issues, improve yield and manufacturing performance, and establish systems for process control and sustainment.
- Collaborate with integration, manufacturing, engineering teams, and suppliers to transfer process solutions into manufacturing.
What they ask for
- Relevant hands-on dry etch semiconductor manufacturing experience, including process development and optimization.
- Experience with plasma etch fundamentals and delivering dry etch solutions that improve yield, reliability, performance, or manufacturability.
- Expertise in statistical analysis and DOE methodologies using tools such as JMP, Python, or MATLAB.
- PhD in a specified semiconductor-related STEM field with relevant experience; or master's degree in such a field plus 2 years of relevant experience; or bachelor's degree in such a field plus 4+ years of industry experience at a leading foundry or dry etch equipment supplier.
Nice to have
- 4+ years of direct industry experience developing and deploying dry etch processes for advanced logic, foundry technologies, or dry etch equipment suppliers.
- Experience with advanced dry etch technologies, characterization methods, APC, or manufacturing defect reduction.
Pay
$133,800.00-255,200.00 USD (total compensation)
Tools
JMP, Python, MATLAB, ICP / CCP plasma etch, HARC, ALE, SEM, TEM
Model-written summary · the original posting is authoritative